LASER APPLICATION SYSTEM

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Laser Soldering System

  • Laser Soldering equipment offers precise, localized laser heating with a quick process time under 10 seconds, it minimizes thermal stress and warpage risk while delivering high precision and energy efficiency for superior quality and productivity.

System Specification
  • ITEM SPEC REMARK
    Material Substrate / Wafer / Panel Max. 400mm
    Solder Ball / Cu Pillar Flux / Solder Paste
    Machine Laser 2 ~ 20Kw -
    920 ~ 1080nm -
    Optic 50 X 50mm ~ 400 X 400mm Depend on Material Size
    Motorizing Beam Control -
    Beam Uniformity > 95% -
    Dimension 1650mm * 1580mm * 2450mm W*L*H
    Function Real Time Temp. Monitoring IR Camera
    Laser Power Monitor, Compensation Power Sensor
    Selective Soldering Option
    Beam Profile & Size Func. Option
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Lid Attach (Metal TIM Snap Cure)

  • Laser tech enables to locally heat the bonding area, which minimize the overall thermal exposure to sensitive devices. Also provide consistent STIM bond line thickness control.

System Specification
  • ITEM SPEC REMARK
    Material Substrate Max. 300mm
    Metal TIM Reel type
    Machine Laser 2 ~ 20Kw -
    920 ~ 1080nm -
    Optic 10 X 10mm ~ 300 X 300mm Depend on Material Size
    Loading Tray / Boat -
    BLT Control BLT < ±10um -
    Dimension 1750mm * 1680mm * 2450mm W*L*H
    Function Real Time Temp. Monitoring IR Camera
    Laser Power Monitor, Compensation Power Sensor
    Selective Soldering Option
    Beam Profile & Size Func. Option