沿革
以不断技术开发来达成的SSP沿革。
实现将想象变为现实的技术
2016 ~ 时下
- Developed New Ball Mount System with Automation
- Developed Ball Placement System Dual Head
- Developed Filter Inspection System for Camera Module
- ISO 45001 Certification
- Selected as Global Small Giant Company
- Presidential Citation in venture promotion
- The best badge in honor the Red Cross
- Registered 40 patents
2015 ~ 2011
- Established New Factory & HQ (2011)
- Developed New Ball Mount System (BPS8200, 7200FC)
- Developed Multi Pickers Package Sorter System for EMI Shield
- Developed Wafer Level Micro Ball Mount System
- Selected as Hope-to-be Hired Company
- Registered 20 patents
2010 ~ 2006
- Developed New Ball Mount M/C (BPS 7200)
- Developed Active Align System (Camera Module)
- Developed FCBGA Automation Line
- CE Certification for Auto Holder Attach System
- 5 Million US$ Export Prize (KOTRA - 2007)
- 10 MiLON US$ Export Prize (KOTRA - 2010)
- ISO 14000 Certification (2010)
- Selected as Export Blue Chip Company (Incheon City)
- Registered 18 patents
2005 ~ 2001
- Developed Holder Attach System (Camera Module)
- Developed Auto Solder Ball Mount System (FCBGA)
- Developed Auto Screen Printing System (FCBGA)
- ISO 9000 Certification (2004)
- Registered R&D Center (KITA - 2004)
- Attained INNO BIZ Company (SMBA - 2004)
- 3 Million US$ Export Prize (KOTRA - 2005)
- Registered 6 Patents (Ball Mounting & Camera Module)
- Move New Factory (Incheon Namdong Industrial Zone)
2000 ~ 1996
- Founded SSP Inc(1996, 06)
- Developed Auto Solder Ball Mount System (PBGA/CA)
- CE Certification for Ball Mount System
- Developed Auto Lamination System
- Developed Semi Auto IC Cutting Equipment (FlexBGA)
- Attained Venture Company
- Registered 5 patents for Solder Ball Mounting Tech
