BALL PLACEMENT SYSTEM
Various types of equipment platform are available to handle different types of carrier format and customer friendly system design per requirements.
- System Features
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▶ Ball placement system for single unit package. Able to handle different types of balls as using dual-head
▶ Applicable package: FCBGA, HFCBGA
▶ Carrier format: 75-200mm in width x 250-320mm in length
▶ Applicable ball pitch/size
▷ Ball pitch: 0.4mm and over
▷ Ball size: 0.2mm and over
▶ Physical spec: 3300mm(L) x 2100mm(W) x 2336mm(H) / 3500kg
- System Performance
-
▶ Placement accuracy: 30um @3sigma
▶ Cycle time
▷ Min 16sec/boat or tray on 2 same tools
▷ Min 20sec/boat or tray on 2 different tools
▶ Conversion kit: Ball tool, Flux tool, Lift block, Pre-aligner
▶ Changeover time: Less 15min
▶ MTBF / MTBA: 168hrs / 3 hrs
▶ Vision system: PRS / Ball amount in a ball tray / Ball tool inspection / QC / 2DID
- System Features
-
▶ Ball placement system for substrate strip or carrier boat. Convertible to strip or carrier boat.
▶ Applicable package: FBGA, PBGA & Flip chip
▶ Substrate format: Carrier boat or substrate strip
▶ Footprint: 2800mm(L) x 1800mm(W) x 1870(H)
▶ Foot weight: 3500kg
- System Performance
-
▶ Placement accuracy: ±30um
▶ Fine pitch capability: 0.450mm ball pitch / 0.200mm ball diameter
▶ Yield: 99.98%
▶ Cycle time
▷ 15-18sec (Single boat without flipper)
▷ 22~25 Sec (Matrix Boat without Flipper)
▷ 27~30 Sec (Matrix Boat with Flipper)
▶ Changeover time: Smart too kit design for easier device change
- System Features
-
▶ Ball placement system for single unit package
▶ Applicable package: FCBGA
▶ Substrate format: Carrier boat
- System Performance
-
▶ Placement accuracy: ±30um
▶ Fine pitch capability: 0.400mm ball pitch / 0.200mm ball diameter
▶ Yield: 99.99%
▶ Cycle time: 15~25sec
▶ Changeover time: Smart tool kit design for easier device change
- System Features
-
▶ Ball placement system for substrate strip carrier
▶ Applicable package: FBGA, PBGA & Flip chip
▶ Substrate format
▷ Carrier boat (Single unit: 12x12mm2 – 50x50mm2)
▷ Substrate strip (50-77.5mm(W) x 200-260mm(L))
▶ Footprint: 2150mm(L) x 1400mm(W) x 1800(H)
▶ Foot weight: 2500kg
- System Performance
-
▶ Placement accuracy: ±50um
▶ Fine pitch capability: 0.450mm ball pitch / 0.280mm ball diameter
▶ Yield: 99.95%
▶ Cycle time: 16sec
▶ Changeover time: Smart tool kit design for easier device change
- System Features
-
▶ Ball placement system for substrate strip carrier with a shuttle
▶ Applicable package: FBGA, FCCSP
▶ Substrate format: Substrate strip (50 ~ 95mm Width × 180~260mm Length)
▶ Footprint: 2300mm(L) x 1350mm(W) x 1820(H)
▶ Foot weight: 3000kg
- System Performance
-
▶ Placement accuracy: ±20um
▶ Fine pitch capability: 0.180mm ball pitch / 0.100mm ball diameter
▶ Yield: 99.98%
▶ Cycle time
▷ 12~14 Sec (Normal Package(1 Dotting/Strip))
▷ 25~30 Sec (Fine Pitch Package(2 Dotting/Strip))
▷ 40~45 Sec (Fine Pitch Package(2 Dotting/Half Strip))
▶ Changeover time: Smart tool kit design for easier device change
- System Features
-
▶ Ball placement system for high density substrate strip carrier
▶ Applicable package: FBGA, FCCSP
▶ Substrate format: Substrate strip (50 ~ 95mm(W) × 200~260mm(L))
- System Performance
-
▶ Placement accuracy: ±30um
▶ Fine pitch capability: 0.300mm ball pitch / 0.150mm ball diameter
▶ Yield: 99.99%
▶ Cycle time: 12~14sec (Depend on IO & size)
▶ Changeover time: Smart too kit design for easier device change
- System Features
-
▶ Ball placement system for substrate strip carrier
▶ Applicable package: FBGA, FCCSP
▶ Substrate format: Substrate strip (74–95mm(W) x 200-260mm(L))
- System Performance
-
▶ Placement accuracy: ±20um
▶ Fine pitch capability: 0.200mm ball pitch / 0.100mm ball diameter
▶ Yield: 99.99%
▶ Cycle time: 12-14sec
▶ Changeover time: Smart too kit design for easier device change
- System Features
-
▶ Semi-auto ball placement system
▶ Applicable package: BGA package family
▶ Carrier format: 50-95mm (W) x 200-260mm(L)
▶ Package types allowable: All kinds of BGA packages
▶ Foot print: 1400mm(L) x 1150mm(W) x 1700mm(H) / 2000kg
- System Performance
-
▶ Cycle time
▷ 10-15 sec for normal package (1-up)
▷ 30-45 sec for fine pitch package (2 or 3-up)
▶ Placement accuracy: ±0.02mm
▶ Fine pitch capability: 0.100mm ball size / 0.18mm ball pitch
▶ Changeover: Ball tool, Flux tool, Lift block / less than 10min
