PROCESS AUTOMATION SYSTEM
Various types of equipment are available for process integration of IC packaging.
- System Features
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▶ Strip loading system having a substrate strip assembled with carrier boat and top cover
- System Performance
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▶ Strip size allowed: 62~95mm Strip & Boat
▶ UPH: 500 strips
▶ Footprint: 1100mm(L) x 1000mm(W) x 1750(H)
▶ Foot weight: 1000kg
- System Features
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▶ Off-loader system having substrate strips loaded into a magazine
▶ Substrate strip size allowed: 30mm-80mm(W) × 185mm-260mm(L)
▶ Footprint: 1350mm(L) x 1180mm(W) x 1820(H)
▶ Foot weight: 900kg
- System Performance
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▶ Warpage handling: Less than 20mm
▶ UPH: 500 strips
▶ Changeover: No conversion kits required
- System Features
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▶ Off-loader system having substrate strips loaded into a strip magazine
▶ Footprint: 895mm(L) x 1182mm(W) x 1350(H)
▶ Foot weight: 750kg
- System Performance
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▶ Conversion Range : 40 ~ 150mm
▶ UPH: 500 strips
▶ 2DID reader available
- System Features
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▶ Unloading system that takes substrate strips from a magazine
▶ Footprint: 1005mm(L) x 1182mm(W) x 1350(H)
▶ Foot weight: 800kg
- System Performance
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▶ Conversion Range : 40 ~ 150mm
▶ Productivity - UPH: 500 strips
▶ 2D barcode reader available
- System Features
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▶ Strip off-loading system to peel off carrier boat and top cover from a substrate strip
▶ Carrier format: Substrate strip and Carrier boat/jig
- System Performance
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▶ Product size allowed: 62~95mm Strip & Boat
▶ Footprint: 1040mm(L) x 1440mm(W) x 1730mm(H)
▶ Foot weight: 1300kg
▶ Yield: 99.99%
▶ UPH: 300-500 strips
- System Features
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▶ Automatic strip loader to have a substrate strip assembled with carrier boat and top cover
▶ Carrier size allowed: 62~95mm Strip & Boat
- System Performance
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▶ Strip Marking Method : CO2 Laser Marking System
▶ Footprint: 1900mm(L) x 900mm(W) x 1820(H)
▶ Foot weight: 1500kg
▶ Yield: 99.99%
▶ UPH: 300-500 strips
- System Features
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▶ Lane diverter for strips or carrier boat
▶ Carrier format: Substrate strip of 74, 77.5 or 95mm in width or subsidiary carrier jig
▶ Foot print: 550mm(L) x 950mm(W) x 1820mm(H)
▶ Weight: 700kg
- System Performance
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▶ SPH: 400strip/hr
▶ Accuray: ±0.1mm
- System Features
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- System Performance
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▶ UPH : 4,300 EA
▶ Substrate Capability : Plastic Tube and JEDEC Tray Handling
▶ Product Flexibility: TSOP, PLCC, BGA etc
▶ Quick Conversion Time : Less than 10 min (Input Module, Input Rail, Shuttle, Output module, Picker)
▶ Foot Print & Weight: 1,450mm (L) x 1,110mm(W) x 1,350mm(H) / 1,000kg
- System Features
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▶ Wafer unloading system having wafers loaded into a magazine
▶ Handling system: 4 inch wafer and wafer carrier jig
▶ Foot print: 1400mm(L) x 1200mm(W) x 1700mm(H)
- System Performance
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▶ Cycle time: 60sec/wafer
▶ Yield performance: 100%
▶ Placement accuracy: ±0.02mm
- System Features
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▶ Wafer loading system with 2D visual inspection camera
▶ Handling system: 4 inch wafer and wafer carrier jig
▶ Foot print: 1400mm(L) x 1200mm(W) x 1700mm(H)
- System Performance
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▶ Cycle time: 60sec/wafer
▶ Inspection system: 2D visual inspection system
▶ Yield performance: 99.98%
▶ Placement accuracy: ±0.02mm
- System Features
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▶ Stiffener or lid attach system
▶ Applicable package: FCBGA
▶ Package size allowed: FCBGA 13×13 – 80×80 with stiffener
▶ Footprint: 3100mm(L) x 1930mm(W) x 2300(H)
▶ Foot weight: 4200kg
- System Performance
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▶ Attachment Method : Max. 220 ℃ Epoxy heat adhesive
▶ Inspection Unit : Look down camera for unit
▶ Look up camera for Stiffener Alignment and orientation
▶ Post Inspection Vision
▶ Cycle time: 7sec/strip
▶ Quick Changeover: Vacuum Block, Flux Stencil
▶ UPH: 1000-1300
- System Features
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▶ Detaping system to peel a protection film off a molded strip
▶ Applicable package: MLF, QFN or MAP type of leadframe package
▶ Package size allowed: 60-95mm(W) × 200-260mm(L)
▶ Footprint: 1925mm(L) x 1100mm(W) x 1800(H)
▶ Foot weight: 1800kg
- System Performance
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▶ Gripp and Demount : Simple conversion and operation
▶ UPH: 120 strips
- System Features
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▶ Detaping system to peel a protection film off EMI shielded parts
▶ Applicable package: LGA
▶ Package size allowed: 3x3mm – 20x20mm
▶ Footprint: 1825mm(L) x 1615mm(W) x 1610(H)
▶ Foot weight: 2000kg
- System Performance
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▶ Vision
▷ Surface inspection
▷ Empty pocket inspection
▶ Reject unit sorting function
▶ Cycle time: 1min/tray
- System Features
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▶ Taping system to attach a protection film onto a leadframe strip
▶ Applicable package: QFN, MLF or MAP type of leadframe package
▶ Product size allowed: Strip 50~95mm(L) X 230~250mm(W)
▶ Footprint: 1200mm(L) x 1240mm(W) x 1550(H)
▶ Foot weight: 900kg
- System Performance
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- ▶ UPH: 50~350 strips per strip format
- System Features
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- System Performance
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▶ Cycle Time: 7 sec/strip
▶ Pre-cleaning Method : Printing Flux on the strip
▶ Substrate Capability : 62mm ~ 95mm Strip (Cu pad)
▶ Quick Conversion Time : less then 10 min. (Vacuum Block, Flux Stencil)
▶ Foot Print & Weight : 2,250mm (L) x 1,250mm (W) x 1,720mm(H) / 2,000kg
- System Features
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- System Performance
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▶ Cycle Time: 7 sec/strip
▶ Pre-cleaning Method : Printing Flux on the strip
▶ Substrate Capability : 62mm ~ 95mm Strip (Cu pad)
▶ Quick Conversion Time : less then 10 min. (Vacuum Block, Flux Stencil)
▶ Foot Print & Weight : 2,250mm (L) x 1,250mm (W) x 1,720mm(H) / 2,000kg
