Laser tech enables to locally heat the bonding area, which minimize the overall thermal exposure to sensitive devices. Also provide consistent STIM bond line thickness control.
ITEM | SPEC | REMARK | |
---|---|---|---|
Material | Substrate | Max. 300mm | |
Metal TIM | Reel type | ||
Machine | Laser | 2 ~ 20Kw | - |
920 ~ 1080nm | - | ||
Optic | 10 X 10mm ~ 300 X 300mm | Depend on Material Size | |
Loading | Tray / Boat | - | |
BLT Control | BLT < ±10um | - | |
Dimension | 1750mm * 1680mm * 2450mm | W*L*H | |
Function | Real Time Temp. Monitoring | IR Camera | |
Laser Power Monitor, Compensation | Power Sensor | ||
Selective Soldering | Option | ||
Beam Profile & Size Func. | Option |